Semiconductor Engineering

Big Shift: Creating Automotive SW Without HW: https://lnkd.in/g4vhYJd3 Agile development may be the best approach for designing new vehicles, but it requires a complete mindset shift for carmakers, particularly with mixed criticality. [Part 2 of roundtable series.] By Ann Mutschler. The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm‘s automotive line of business; Charles Alpert, R&D automotive fellow at Cadence Design Systems; Stefano (Steve) Spadoni, zone controller and power distribution application manager at Infineon Technologies; Rebeca Delgado, chief technology officer and principal AI engineer at Intel Corporation Automotive; Cyril Clocher, senior director in the automotive product line for high-performance computing at Renesas Electronics; David Fritz, vice president, hybrid and virtual systems at Siemens Digital Industries Software EDA; and Marc Serughetti, senior director, systems design group at Synopsys Inc.  [Find part 1 here https://lnkd.in/gVMf6iaa] #automotive #softwaredefinedvehicles #SDV #agile

Demand for higher reliability requires more advanced and historically slow equipment and methodologies, but improvements are on the way. By Gregory Haley. https://lnkd.in/eXFm6NGK Part 2 of a roundtable, discussing metrology at the most advanced nodes and the impact of using different substrates, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; John R Hoffman, computer vision engineering manager at Nordson TEST & INSPECTION & Measurement; and Jiangtao Hu, senior technology director at Onto Innovation. (Part 1 can be found here https://lnkd.in/eMy-4G36 ) #semiconductor #metrology #glasssubstrates #semiconductormetrology

Promises And Pitfalls Of SoC Restructuring https://lnkd.in/gTTdvr4f Sidestepping data incompatibility issues in heterogeneous chip designs. As chips become more complex and increasingly heterogeneous, it’s becoming more difficult to keep track of different methodologies, tools, and blend data from different sources to create a chip. Tim Schneider, staff application engineer at Arteris, explains why IP-XACT has become so critical, why it took so long to gain a solid foothold in chip design, and how the new IP-XACT standard interfaces with SystemVerilog. #chipdesign #semiconductor #IPXACT #SystemVerilog #heterogeneousintegration Tim S. Arteris

SemiEngineering's latest newsletters. https://lnkd.in/gBSmeftb 5 channels: -Manufacturing, Packaging and Materials -Low Power, High Performance -Systems and Design -Test, Measurement and Analytics -Automotive, Security and Pervasive Subscribe here (right side box) #semiconductor #semiconductormanufacturing #EDA #chipdesign #lowpower #advancedpackaging #automotiveelectronics #HardwareSecurity #highperformancecomputing #dataanalytics #semiconductortest

Early news roundup this week: https://lnkd.in/gs2NHGxP Sk Hynix’s bets big on HBM; GF’s purchase; Altair acquires EDA company; high-performing, low-power LLM without matrix multiplication; US Tech Hubs funding; Renesas-Altium deal passes key test; workforce drive; imec’s CMOS 2.0. 3D interconnect and backside technologies and more... #semiconductor #EDA #HBM #LLMs #acquisitions SK hynix GlobalFoundries Rogue Valley Microdevices, Inc. SILICON BOX SEMI Cadence Design Systems Google Renesas Electronics Altair Natcast.org Purdue University College of Engineering Purdue University Eindhoven University of Technology KU Leuven Mixel, Inc. Flex Logix Technologies, Inc. stiftung neue verantwortung University of California, Santa Cruz Rui-Jie Zhu, Yu Zhang, Ethan Sifferman Julien Ryckaert Christina Rupp ASML Metrics Design Automation Cadence Design Systems

Security Focus Widens To HW, SW, Ecosystems: https://lnkd.in/gVTFYYPu Change reflects higher value of data and push to more heterogeneous designs. By Ann Mutschler. #cybersecurity #HardwareSecurity #semiconductor #softwaresecurity Cycuity Infineon Technologies Intel Corporation Rambus TXOne Networks Siemens Digital Industries Software Synopsys Inc Vivek Tiwari Dana Neustadter Neeraj Paliwal Andreas Kuehlmann Josef Haid Lee Harrison Jim Montgomery Victoria Coleman United States Air Force

Verification Tools Straining To Keep Up: https://lnkd.in/g4AbbNhv Verification engineers are the unsung heroes of the semiconductor industry, but they are at a breaking point and desperately in need of modern tools and flows to deal with the rapidly increasing pressures. By Brian Bailey. #EDA #verification #semiconductor #UVM #portablestimulus Ashish Darbari Axiomise Chris Mueth Keysight Technologies Marc Swinnen Ansys Arturo Salz Synopsys Inc Gabriel Pachiana Fraunhofer IIS, Division Engineering of Adaptive Systems EAS Tom Fitzpatrick Siemens EDA (Siemens Digital Industries Software) Matt Graham Cadence Design Systems

Data abstractions are a necessary part of enabling shift left, extend right, and stretch sideways, but that data must be carefully managed. By Brian Bailey. https://lnkd.in/ghZ7nAAX #EDA #verification #shiftleft #semiconductor Chris Mueth Keysight Technologies Ansys Lang Lin Insaf Meliane Arteris Frank Schirrmeister Synopsys Inc Matt Graham Cadence Design Systems Marc Swinnen Simon Rance

New technical papers recently added to Semiconductor Engineering’s library. https://lnkd.in/gwg5EMVC #semiconductor #interconnects #plasmaetch #IRdrop #SiC #NVM #quantum #photonics imecKU Leuven University of Maryland IBM Arkema Intel Corporation Lam Research UCLA National Tsing Hua University, National Taiwan University MediaTek University of Cambridge, University of Warwick, Chongqing University SpaceX Ruhr University Bochum of University of Duisburg-Essen Niels Bohr Institute, University of Copenhagen, University of Bristol, Aalto University Jean-Philippe Soulié Kiroubanand SANKARAN Benoit Van Troeye Gottlieb Oehrlein, Robert Bruce Keren Kanarik Ameer Janabi Luke Shillaber Felix Staudigl, Dr.-Ing. Jan Philipp Thoma Christian Niesler, Lingyun Y., Martin Trapp, Jelin Leslin Edward Deacon

SemiEngineering's latest Manufacturing, Packaging and Materials Newsletter https://lnkd.in/ggnB_-dQ #semiconductor #semiconductormanufacturing #EUV #CMP #ruthenium #GPU #advancedpackaging #DRAM ASE Global United Microelectronics Corporation (UMC) Lam Research Brewer Science Promex Industries Inc. QP Technologies Amkor Technology, Inc. Synopsys Inc Tignis D2S, Inc.