Nhu Dau

Explore the Potential of Your Electronics with InYantra's Comprehensive PCB Assembly Solutions! At InYantra, we pride ourselves in providing excellent PCB assembly services that meet the various needs of our customers. Our all-inclusive solutions are made to help you every step of the way while guaranteeing effectiveness, dependability, and quality in your product development.  Complete Range of PCB Assembly Services: InYantra offers a comprehensive range of PCB assembly services, ranging from design and prototype to large-scale production. Because we are experts in both through-hole and surface mount technology, we can manage a wide range of project needs. Whether you're working on a large-scale production run or a high-mix, low-volume project, our staff is prepared to meet your needs with efficiency and professionalism.  Advanced Technology and Skilled Team: Our modern facilities are equipped with the latest technology in order to provide the best possible results. Years of expertise combined with the skills of our experienced engineers and technicians allow us to provide cutting-edge PCB manufacturing solutions that adhere to the strongest industry requirements. We make use of state-of-the-art machinery for automated testing, 3D X-ray inspection, and SMD assembly to guarantee that every product we supply is perfect. Quick-Turn PCB Assembly: Time is of the essence in today’s fast-paced market. At InYantra, we recognize the value of prompt delivery. Our quick-turn PCB assembly services are made to help you launch products more quickly without risking quality. We can provide quick prototyping or urgent production, depending on your needs. Commitment to Quality and Reliability: These two attributes form the basis of everything we do. To guarantee that every PCB assembly we make meets the highest standards of performance and longevity, we strictly adhere to industry standards and quality control procedures. Experience the difference in quality, dependability, and efficiency when you work with InYantra for your PCB assembly needs.  Visit our website to learn more about our services: https://www.inyantra.com/ Email:- info@inyantra.com Call us:- +91 9511903752 #PCBAssemblyServices #ElectronicsManufacturing #InYantra #QualityManufacturing #AdvancedTechnology

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𝐓𝐒𝐌𝐂 𝐐𝟏 - 𝟐𝟎𝟐𝟒 𝐐𝐮𝐚𝐫𝐭𝐞𝐫𝐥𝐲 𝐑𝐞𝐬𝐮𝐥𝐭𝐬 𝐚𝐫𝐞 - $𝟏𝟖.𝟖𝟕 𝐛𝐢𝐥𝐥𝐢𝐨𝐧  Source: By TSMC 💡 (https://lnkd.in/gPK74sWW) “Our #business in the first quarter was impacted by #smartphone seasonality, partially offset by continued #HPC-related demand,” said Wendell Huang, Senior #VP and #Chief #Financial #Officer of #TSMC. 2Q24 Guidance Based on our current business outlook, management expects: And, based on the exchange rate assumption of 1 US dollar to 32.3 NT dollars, management expects: ◼ Gross profit margin to be between 51% and 53% ◼ Operating profit margin to be between 40% and 42%

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Exciting news! 🌟 Discover how MediaTek-powered Chromebooks are transforming education at The L. Hollingworth School for the Talented and Gifted. 💻💡 #MediaTek #미디어텍 #MediaTekKompanio #Chromebooks #CaseStudy

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semiStocks: The Week's Leaders, Laggards, Regional & Sector Performance                     ... for the week ending June 9, 2024 W/W Plc W/W Chg 7-Jun 1 23.4% Valens 2 15.7% Hua Hong 3 13.8% Navitas 4 13.1% Aehr Test 5 11.4% indie Semi 6 11.1% SMIC 7 11.1% Axcelis 8 10.3% NVIDIA 13.7% Average 83 -4.4% Hygon 84 -4.5% Microchip 85 -4.5% Montage 86 -5.6% Silicon Labs 87 -5.9% Loongson 88 -8.4% Impinj 89 -18.1% Lattice 90 -19.8% Semtech -8.9% Average W/W Chg 0.3% America 2.2% China 7.2% EMEA 0.4% Japan 3.6% Korea 2.6% Taiwan 0.2% Other Asia -2.0% Logic 3.1% AI 0.9% Auto 1.3% Mobile 5.0% Memory 1.2% Analog & Power 3.9% Foundry 2.5% OSAT Can you help me out? Please click the like button so I know these write-ups are of value for you. This for the greater good as I have no investments in these stocks. Also, no guarantees here. I am not a stock analyst. These are just observations and opinions. My opinions here are subject to many unknowns that will cause actual results and outcomes to be different from what is written. This is not investment advice and is not tailored to your specific investment needs. Do your homework and consult a professional investment advisor. #Semiconductor #StockstoWatch #stockmarket #techstocks

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Title : #TSMC #Semiconductor #Photonics #UMC TSMC's Taiwan operations unaffected by magnitude 6, 6.3 quakes Cleanroom staff evacuated as precaution though operations quickly return to normal Apr. 23, 2024 17:17 by #Sean Scanlan #TaiwanNews TAIPEI (Taiwan News) — Taiwan Semiconductor Manufacturing Co. (TSMC) said the earthquakes of magnitude 6 and 6.3 centered in Hualien on Tuesday morning (April 23) had little impact on operations. The situation did not meet the criteria for factory evacuation, but as a precaution, a small number of cleanroom staff were evacuated. No structural damage to facilities was observed, and factory operations and safety systems quickly returned to normal, per CNA. United Microelectronics Corp. (UMC), a smaller contract chipmaker, said its wafer plants in Hsinchu Science Park and Southern Taiwan Science Park also remained unaffected by earthquakes early Tuesday morning. On April 18, TSMC announced the 7.2-magnitude earthquake on April 3 led to second-quarter losses of NT$3 billion (US$92 million) after deducting insurance claims. TSMC said the Hualien earthquake was the strongest in 25 years, registering magnitude 5 in Hsinchu, Longtan, and Zhunan science parks and magnitude 4 at Taichung and Tainan science parks, per CNA. TSMC said experience in earthquake response and disaster prevention, along with regular safety drills, allowed 70% of wafer fab equipment to return to normal operations within 10 hours of the quake. Furthermore, no power outages or damage affected high-end extreme ultraviolet (EUV) machines. TSMC estimated the April 3 earthquake would affect gross profit margin by about 0.5% in the second quarter due to wafer damage and material losses. The company still expects full-year revenue growth between 21-26%.   # United Microelectronics Corp. # clean room # EUV # TSMC

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We are pleased to introduce TSMC 3DFabric™, our comprehensive family of 3D Silicon Stacking and Advanced Packaging Technologies. 3DFabric complements our advanced semiconductor technologies to unleash our customer's innovations. Packaging technologies were once considered just backend processes, almost an inconvenience. Times have changed. Computing workloads have evolved more over the past decade than perhaps the previous four decades. Cloud computing, big data analytics, artificial intelligence (AI), neural network training, AI inferencing, mobile computing on advanced smartphones and even self-driving cars are all pushing the computing envelope. #business #india #china #europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation #kindness #bestadvice #personaldevelopment #linkedin #hiring #careers #help #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #Technology #recycle

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The surge in AI demand is fueling strong prices for DRAM and high-bandwidth memory (HBM) from top manufacturers Samsung and SK Hynix. With both companies shifting over 20% of DRAM production to focus on HBM, the competition is heating up. SK Hynix's HBM chips are already sold out for 2024 and nearly booked for 2025, with NVIDIA as a major customer. Meanwhile, Samsung, fully booked, is optimistic about 2025, leading in HBM technology with its 12-layer HBM3e. According to Trendforce, the HBM market is set to soar, with prices projected to increase by 5-10% in 2025. The potential for HBM to surpass 30% of the total DRAM market value by 2025 is exciting news for tech enthusiasts! https://lnkd.in/g5TmpmYu #AI #TechInnovation #MemoryChips #DRAM #HBM #Samsung #SKHynix #NVIDIA #Semiconductors #TechIndustry

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Here offer Micron N48R：QLC HBM MT29F1T08GBLCEN48R3WC1-R Q’ty：300K samsung V5 256Gb. 6k EP3C16F484C6N EP3C5F256C8N  M393A4K40EB3-CWE server 1. H5WRAGESM8W-N8L Qty:8,000/pcs USD650/pcs D/C:Within 2 years L/T:10Weeks HK EXW 2. KHAA84901B-JC17 Qty:10,000pcs USD480/pcs D/C:21+ L/T:12-16Weeks HK EXW The HBM4 war begins! Memory chip stacking is difficult to solve, Hybrid Bonding is the key to breakthrough SK Hynix, a major Korean memory manufacturer, participated in COMPUTEX 2024 for the first time, displaying the latest HBM3E memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealed that Hybrid bonding will become a very important part of the chip stack. MR-MUF is a process in which semiconductor wafers are attached to circuits and "EMC" (liquid epoxy molding compound) is used to fill the gaps between wafers or between wafers and bumps when stacking the wafers. At present, MR-MUF technology can make chips closer together, improve heat dissipation performance by 10%, improve energy efficiency by 10%, product capacity reaches 36GB, and can be stacked 12 layers.As for competitors such as Samsung and Micron, which use TC-NCF technology (thermal compression with non-conductive film, non-conductive film thermal compression), it is necessary to convert the material into a solid through high temperature and high pressure, then melt it, and then clean it. The total process More than 2-3 steps, MR-MUF can be completed in one go and no further cleaning is required. Compared with NCF, MR-MUF has about twice the thermal conductivity, which has a great impact on process speed and yield. As the number of stacked layers increases, the HBM package thickness is limited to 775 microns (μm). Therefore, memory manufacturers must think about how to stack more layers within a certain height. This is also a big challenge for current packaging technology, and hybrid bonding (Hybrid bonding) is likely to be one of the solutions.stack more than 20 layers (ie no more than 775 microns) through Hybrid bonding technology. According to Korean media reports, HBM4E will be a 16-20-layer product and is expected to debut in 2028. SK Hynix will use 10-nanometer sixth-generation (1c) DRAM in HBM4E for the first time, and the memory capacity is expected to be significantly increased. (Source of the first picture: Science and Technology News).#china #europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation #kindness #bestadvice #personaldevelopment #linkedin #hiring #careers #help #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #Technology #recycle]\\

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AI PC starts with Intel Core Ultra inside. checkout Microsoft Surface Pro Laptop 6 with latest Intel Core Ultra

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AI PC starts with Intel Core Ultra inside. checkout Microsoft Surface Pro Laptop 6 with latest Intel Core Ultra

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SK hynix: #GDDR7 Mass Production To Start in Q1'2025 Being a major JEDEC #memory standard, GDDR7 is slated to be produced by all three of the Big Three memory #manufacturers. But it seems that not all three vendors will be kicking off mass production at the same time. #SKhynix was at this year's #Computex trade show, showing off their full lineup of memory #technologies – including, of course, GDDR7. SK hynix is the last of the major memory vendor's we've seen promoting their memory, and fittingly, they seem to be the last in terms of their mass production schedule. According to company representatives at the show, the firm will not kick off mass production of their GDDR7 chips until the first quarter of 2025. Thanks again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eEMBgD_N #semiconductorindustry #semiconductors #semiconductor #technology #tech #innovation #ai #semiconductormanufacturing #dram #mobile #it

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Semiconductor Industrial Breaking News 1. Samsung and SK Hynix expect DRAM and HBM prices to remain strong this year due to growing demand for AI-related chips. Samsung and SK Hynix will convert more than 20% of their DRAM production lines to HBM production lines to meet demand. SK Hynix HBM chips are sold out in 2024 and almost sold out in 2025; Samsung HBM products are also sold out. 2. According to supply chain, Samsung and SK Hynix are shifting their focus to high-bandwidth memory (HBM) and DDR5 memory, and will stop supplying DDR3 niche DRAM from the second half of the year. 3. OpenAI officially announces new large-scale AI model GPT-4o: supports multi-modal visual/voice dialogue. 4. Microchip launches radiation-hardened DC-DC 50W power converters to provide high-reliability solution for new space applications. 5. According to wccftech, the latest rumors indicate that Apple has signed a supply agreement with Samsung for foldable iPhone displays. 6. Microsoft's latest breakthrough in quantum computing: Error rate reduced by 800 times, 14,000 experiments without errors. 7. The Biden administration in the United States recently announced that the U.S. Department of Commerce has reached a non-binding preliminary terms memorandum (PMT) with Polar Semiconductor. Under the Chip and Science Act, the U.S. Commerce Department will provide the company with up to $120 million in incentive funding to expand Polar Semiconductor’s manufacturing facility in Bloomington, Minnesota, and introduce new technologies. 8. Kim Gwi-wook, head of HBM at SK hynix, said that HBM technology in the industry has reached a new level. Industry demand has prompted SK Hynix to speed up the development process and launch HBM4E memory as early as 2026. The associated memory bandwidth will be 1.4 times that of HBM4. 9. GPT-4o sets off AI craze again. High-performance memory chips such as high-bandwidth memory (HBM) may still face supply constraints this year as the artificial intelligence boom drives explosive demand for such memory chips, analysts warn. 10. TSMC said on the May 14th that it plans to start building a European factory in Q4 2024. Paul DeBot, head of TSMC's European operations, said work at the plant is proceeding as planned. TSMC announced in August 2023 that it would build the company's first European factory in Germany. The plant is expected to be operational by the end of 2027. #Samsung #SKHynix #DRAM #HBM #AI #DDR5 #memory #DDR3 #OpenAI #GPT4o #Microchip #Apple #Microsoft #Biden #UnitedStates #TSMC #Germany #europe #st #stmicroelectronics #TI #texasinstruments #renesas #intersil #powerintegrations #nuvoton #winbond #gigadevice #gd #wafer #GaN #SIA #NVIDIA #artificialintelligence #robotics #robot #drones #hpc #pc #automotive #vehicles #auto #cars #ev #electricvehicles #electriccar #adas #renewableenergy #pv #powersupply #bms #China #Japan #southkorea #eu #geopoliticaltensions #geopolitics #russiaukrainewar #tradesanction #tradewar

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The MediaTek Dimensity 6300 brings a  performance boost, great gaming, and vibrant visuals to mainstream 5G smartphones. The Dimensity 6300 packs a powerful punch into a very tiny chip. Features include:  📸 108MP cameras with enhanced noise reduction   🎮 Faster games (up to 10% faster FPS than the previous generation and 50%+ GPU performance over the competitors)   🌈 Billion color displays with vibrant AMOLED and displays speeds of up to 120Hz 📡 Premium 5G technologies, including fully integrated 5G modem with downlink speeds up to 3.3Gb/s   🔋 Exceptional power efficiency thanks to TSMC 6nm-class chip production #MediaTek #MediaTekDimensity6300 #mainstreamsmartphones #Dimensity #5G

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We have won the prestigious TM Forum Excellence Award in the Excellence in AI Innovation category for revolutionizing Operations and Maintenance with our cutting-edge Generative AI solution! ⚡ Curious about: • The challenges we helped China Mobile overcome? • How our GenAI solution aligns with China Mobile's strategy? • The transformative impact on network operations? Dive into the full story behind our award-winning solution. Read this article to learn more: https://lnkd.in/drabmX-h

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"Semiconductor distribution network: key insights." ->Manufacturers collaborate with distributors for several strategic reasons: 1. Market Reach | 2. Efficiency 3. Risk Mitigation | 4. Working Capital Management 5. Customer Service | 6. Global Expansion ->Manufacturers Don't Sell Directly to OEM Customers: 1. Focus on Core Competencies | 2. Scalability 3. Logistics and Fulfillment | 4. Risk Management 5. Value-Added Services Cheers! #ElectronicComponents #SemiconductorDistribution #NetworkInsights #MarketReach #Efficiency #RiskMitigation #WorkingCapital #CustomerService #GlobalExpansion #CoreCompetencies #Scalability #Logistics #Fulfillment #ValueAddedServices #Electronics #Components #B2B #BusinessStrategy #Partnerships #LogisticsManagement #MarketPenetration #ChannelPartners #TechIndustry #DistributionNetworks #OEMCustomers #ManufacturerRelations

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Every day, we're faced with choices, and what we choose defines our identities and our futures. As MediaTek enters its 27th year, we look back at the choices of our Chairman, Mr. MK Tsai, his daring leap of faith to establish MediaTek, and subsequently build one of the world's largest fabless semiconductor companies. Starting with a small team with big dreams, our global team now powers over 2 billion devices a year, with many more to come as we uncover innovations and invent new technologies that drive the connected, intelligent future. "Tomorrow Built by You" signifies the pivotal role each of us plays in shaping the next chapter of the world. Together, we are creating a tomorrow that is smarter, more connected, and driven by the collective vision and effort of each one of you. #mediatek #tomorrowbuiltbyyou #mediatekdimensity

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𝐇𝐮𝐚𝐰𝐞𝐢 𝐄𝐱𝐞𝐜𝐮𝐭𝐢𝐯𝐞 𝐒𝐚𝐲𝐬 𝐓𝐡𝐚𝐭 𝐈𝐭 𝐇𝐚𝐬 𝐁𝐞𝐞𝐧 𝐔𝐧𝐚𝐛𝐥𝐞 𝐓𝐨 𝐒𝐞𝐜𝐮𝐫𝐞 𝟑.𝟓𝐧𝐦 𝐂𝐡𝐢𝐩 𝐒𝐡𝐢𝐩𝐦𝐞𝐧𝐭𝐬 𝐅𝐫𝐨𝐦 𝐓𝐒𝐌𝐂 𝐃𝐮𝐞 𝐓𝐨 𝐔.𝐒. 𝐒𝐚𝐧𝐜𝐭𝐢𝐨𝐧𝐬, 𝐍𝐞𝐞𝐝𝐬 𝐓𝐨 𝐄𝐟𝐟𝐞𝐜𝐭𝐢𝐯𝐞𝐥𝐲 𝐔𝐭𝐢𝐥𝐢𝐳𝐞 𝟕𝐧𝐦 𝐍𝐨𝐝𝐞 Source: By Omar Sohail via Wccftech (https://lnkd.in/grFW8PAC) The #Kirin9000S is considered by the industry to be a #semiconductor miracle, as Huawei had to deal with overwhelming odds, thanks to the U.S. sanctions, just to #mass produce a chipset last year. Now that the former #Chinese giant has successfully displayed its #chip-making prowess, the next step is to switch to advanced #manufacturing processes to ensure that it maintains some pace with the #competition. Unfortunately, in its reported quest to acquire TSMC’s 3.5nm #chip shipments, a #Huawei executive has expressed disappointment that the attempt has been unsuccessful due to the same #trade #ban.

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