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US Opens $1.6 Billion Competition for Chip Packaging Research

The Biden administration is launching a $1.6 billion funding competition for chip packaging research and development projects, marking the latest attempt to revitalize the domestic <-bsp-bb-link state="{"bbHref":"bbg://screens/tni%20us%20sem","_id":"00000190-9889-d0b4-afdb-ddffe38a0000","_type":"0000016b-944a-dc2b-ab6b-d57ba1cc0000"}">semiconductor industry.

NextNav Rises on US DOT Award to Test PNT Services

NextNav shares climb as much as 8% in premarket trading on Tuesday after announcing a new award from US Department of Transportation to conduct real-world field tests of its 3D PNT technologies as complement and backup to GPS.

Infrastructure: The Hardest Easiest Problem

A brief history of highway infrastructure challenges in the United States.

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